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Deutschlands reichweitenstarkes Portal für News, Downloads, unabhängige Tests & Kaufberatung. Expertentipps rund um Tech- & Verbraucherthemen. Der Chip-Hersteller ARM wechselt den Besitzer – schon wieder! Nach nur vier Jahren beim japanischen Softbank-Konzern geht es zu Nvidia! Prozessor ©. Unter System-on-a-Chip (SoC, dt. Ein-Chip-System), auch System-on-Chip, versteht man die Hierfür ist in einem klassischen PC beispielsweise eine separate Grafikkarte oder ein im Chipsatz integrierter Grafikkern (GPU) zuständig. Chiptune, kurz Chip, ein Musikgenre. Chip als Name. Chip (Zeitschrift), deutsche Computerzeitschrift; Chip Online, Internetportal der vorgenannten deutschen. Sujet: Computer-Chip im Ball notwendig?, Entrées: , dernière réponse: 8 mars - h. Finde und downloade kostenlose Grafiken für Computer Chip. + Vektoren, Stockfotos und PSD. ✓ Kommerzielle Nutzung gratis ✓ Erstklassige Bilder. Englisch-Deutsch-Übersetzungen für computer chip im Online-Wörterbuch ferienwohnungensalzburg.eu (Deutschwörterbuch).
This is in response to heat-versus-speed limit, that is about to be reached [ when? This design provides a new challenge to chip programming.
Parallel programming languages such as the open-source X10 programming language are designed to assist with this task. In the early days of simple integrated circuits, the technology's large scale limited each chip to only a few transistors , and the low degree of integration meant the design process was relatively simple.
Manufacturing yields were also quite low by today's standards. As metal—oxide—semiconductor MOS technology progressed, millions and then billions of MOS transistors could be placed on one chip, [87] and good designs required thorough planning, giving rise to the field of electronic design automation , or EDA.
The first integrated circuits contained only a few transistors. Early digital circuits containing tens of transistors provided a few logic gates, and early linear ICs such as the Plessey SL or the Philips TAA had as few as two transistors.
The number of transistors in an integrated circuit has increased dramatically since then. The early integrated circuits were SSI.
SSI circuits were crucial to early aerospace projects, and aerospace projects helped inspire development of the technology.
Both the Minuteman missile and Apollo program needed lightweight digital computers for their inertial guidance systems. Although the Apollo guidance computer led and motivated integrated-circuit technology, [91] it was the Minuteman missile that forced it into mass-production.
The demand by the U. Government supported the nascent integrated circuit market until costs fell enough to allow IC firms to penetrate the industrial market and eventually the consumer market.
A typical application was FM inter-carrier sound processing in television receivers. The next step in the development of integrated circuits introduced devices which contained hundreds of transistors on each chip, called "medium-scale integration" MSI.
In , Frank Wanlass demonstrated a single-chip bit shift register he designed, with a then-incredible MOS transistors on a single chip.
Further development, driven by the same MOSFET scaling technology and economic factors, led to "large-scale integration" LSI by the mids, with tens of thousands of transistors per chip.
Integrated circuits such as 1K-bit RAMs, calculator chips, and the first microprocessors, that began to be manufactured in moderate quantities in the early s, had under 4, transistors.
True LSI circuits, approaching 10, transistors, began to be produced around , for computer main memories and second-generation microprocessors.
Some SSI and MSI chips, like discrete transistors , are still mass-produced, both to maintain old equipment and build new devices that require only a few gates.
The series of TTL chips, for example, has become a de facto standard and remains in production. The final step in the development process, starting in the s and continuing through the present, is "very-large-scale integration" VLSI.
The development started with hundreds of thousands of transistors in the early s, As of [update] , transistor counts continue to grow beyond ten billion transistors per chip.
Multiple developments were required to achieve this increased density. Manufacturers moved to smaller MOSFET design rules and cleaner fabrication facilities so that they could make chips with more transistors and maintain adequate yield.
Electronic design tools improved enough to make it practical to finish these designs in a reasonable time.
Modern VLSI devices contain so many transistors, layers, interconnections , and other features that it is no longer feasible to check the masks or do the original design by hand.
Instead, engineers use EDA tools to perform most functional verification work. In the first one-megabit random-access memory RAM chips were introduced, containing more than one million transistors.
Microprocessor chips passed the million-transistor mark in and the billion-transistor mark in To reflect further growth of the complexity, the term ULSI that stands for "ultra-large-scale integration" was proposed for chips of more than 1 million transistors.
Wafer-scale integration WSI is a means of building very large integrated circuits that uses an entire silicon wafer to produce a single "super-chip".
Through a combination of large size and reduced packaging, WSI could lead to dramatically reduced costs for some systems, notably massively parallel supercomputers.
A system-on-a-chip SoC or SOC is an integrated circuit in which all the components needed for a computer or other system are included on a single chip.
The design of such a device can be complex and costly, and whilst performance benefits can be had from integrating all needed components on one die, the cost of licensing and developing a one-die machine still outweigh having separate devices.
With appropriate licensing, these drawbacks are offset by lower manufacturing and assembly costs and by a greatly reduced power budget: because signals among the components are kept on-die, much less power is required see Packaging.
This has led to an exploration of so-called Network-on-Chip NoC devices, which apply system-on-chip design methodologies to digital communication networks as opposed to traditional bus architectures.
A three-dimensional integrated circuit 3D-IC has two or more layers of active electronic components that are integrated both vertically and horizontally into a single circuit.
Communication between layers uses on-die signaling, so power consumption is much lower than in equivalent separate circuits. Judicious use of short vertical wires can substantially reduce overall wire length for faster operation.
To allow identification during production most silicon chips will have a serial number in one corner. It is also common to add the manufacturer's logo.
Ever since ICs were created, some chip designers have used the silicon surface area for surreptitious, non-functional images or words.
These are sometimes referred to as chip art , silicon art, silicon graffiti or silicon doodling. From Wikipedia, the free encyclopedia.
Electronic circuit. For the electronics magazine, see Silicon Chip. For other uses, see Microchip disambiguation.
Main article: Invention of the integrated circuit. See also: Planar process , p—n junction isolation , and Surface passivation.
Main article: Transistor—transistor logic. Further information: MOS integrated circuit. See also: List of semiconductor scale examples , Mixed-signal integrated circuit , Moore's law , Three-dimensional integrated circuit , Transistor count , and Very Large Scale Integration.
Main articles: Electronic design automation , Hardware description language , and Integrated circuit design.
This article needs additional citations for verification. Please help improve this article by adding citations to reliable sources.
Unsourced material may be challenged and removed. Main article: Semiconductor fabrication. Main article: Integrated circuit packaging.
Main article: Integrated circuit layout design protection. This article needs to be updated. Please update this section to reflect recent events or newly available information.
October Further information: Heat generation in integrated circuits. Main article: Very-large-scale integration. Further information: Wafer-scale integration , System on a chip , and Three-dimensional integrated circuit.
Electronics portal. Retrieved 14 March Nowadays when people say 'integrated circuit' they usually mean a monolithic IC, where the entire circuit is constructed in a single piece of silicon.
The Art of Electronics 2nd ed. Cambridge University Press. Integrated circuits, which have largely replaced circuits constructed from discrete transistors, are themselves merely arrays of transistors and other components built from a single chip of semiconductor material.
CHM Blog. Computer History Museum. Retrieved 13 August History of Semiconductor Engineering. Johns Hopkins University Press.
Proceedings of the IEEE. Those of us active in silicon material and device research during — considered this successful effort by the Bell Labs group led by Atalla to stabilize the silicon surface the most important and significant technology advance, which blazed the trail that led to silicon integrated circuit technology developments in the second phase and volume production in the third phase.
Solid State Technology. Patent 3,, granted on 10 April , filed 22 April Archived from the original on 19 September Retrieved 22 April MIT Press.
EE Times. Archived from the original on 7 January Retrieved 23 April Mackenzie 16 May American Microelectronics Data Annual — World Scientific.
Retrieved 25 May The Electrochemical Society Interface. Retrieved 3 August Retrieved 22 July IEEE Spectrum.
Institute of Electrical and Electronics Engineers. The Silicon Engine. Retrieved 13 October Scientific American. Bibcode : SciAm.
Retrieved 1 August Dennard, and Ghavam G. Shahidi Retrieved 11 February Fujita A decade of MEMS and its future. Narasimha; et al. Birkholz; A.
Mai; C. Wenger; C. Meliani; R. Scholz WIREs Nanomed. Graham; J. Robbins; C. Bowen; J. Taylor Semiconductor Engineering.
Electronic Design Automation Consortium. Archived from the original on 2 August Retrieved 29 July Gray; Paul J. Hurst; Stephen H.
Lewis; Robert G. Meyer Analysis and Design of Analog Integrated Circuits. Rabaey; Anantha Chandrakasan; Borivoje Nikolic Digital Integrated Circuits 2nd ed.
Retrieved 22 October Washington, D. Bloomburg Businessweek. Retrieved 20 May United States Copyright Office.
L 24 IEEE Micro. Digital Apollo: Human and Machine in Spaceflight. The MIT Press. Olympus Publishing Company. We were burning: Japanese entrepreneurs and the forging of the electronic age.
Basic Books. Bibcode : ITED Retrieved 21 September La; Shi, L; et. Digital electronics. Digital signal Boolean algebra Logic synthesis Logic in computer science Computer architecture Digital signal Digital signal processing Circuit minimization Switching circuit theory.
Logic synthesis Place and route Placement Routing Register-transfer level Hardware description language High-level synthesis Formal equivalence checking Synchronous logic Asynchronous logic Finite-state machine Hierarchical state machine.
Computer hardware Hardware acceleration Digital audio radio Digital photography Digital telephone Digital video cinema television Electronic literature.
Metastability Runt pulse. Electronic components. Potentiometer digital Variable capacitor Varicap. Capacitor types Ceramic resonator Crystal oscillator Inductor Parametron Relay reed relay mercury relay.
Semiconductor packages. Electronic packaging Integrated circuit packaging List of integrated circuit packaging types Printed circuit board Surface-mount technology Through-hole technology.
The modern computer chip saw its beginning in the s through two separate researchers who were not working together, but developed similar chips.
These first computer chips used relatively few transistors, usually around ten, and were known as small-scale integration chips.
As time went on through the century, the amount of transistors that could be attached to the computer chip increased, as did their power, with the development of medium-scale and large-scale integration computer chips.
The latter could contain thousands of tiny transistors and led to the first computer microprocessors. There are several basic classifications of computer chips, including analog, digital and mixed signal varieties.
These different classifications of computer chips determine how they transmit signals and handle power. Their size and efficiency are also dependent upon their classification, and the digital computer chip is the smallest, most efficient, most powerful and most widely used, transmitting data signals as a combination of ones and zeros.
Today, large-scale integration chips can actually contain millions of transistors, which is why computers have become smaller and more powerful than ever.
Not only this, but computer chips are used in just about every electronic application including home appliances, cell phones, transportation and just about every aspect of modern living.
It has been posited that the invention of the computer chip has been one of the most important events in human history.
Please enter the following code:. Login: Forgot password? Communication between layers uses on-die signaling, so power consumption is much lower than in equivalent separate circuits.
Judicious use of short vertical wires can substantially reduce overall wire length for faster operation. To allow identification during production most silicon chips will have a serial number in one corner.
It is also common to add the manufacturer's logo. Ever since ICs were created, some chip designers have used the silicon surface area for surreptitious, non-functional images or words.
These are sometimes referred to as chip art , silicon art, silicon graffiti or silicon doodling. From Wikipedia, the free encyclopedia. Electronic circuit.
For the electronics magazine, see Silicon Chip. For other uses, see Microchip disambiguation. Main article: Invention of the integrated circuit.
See also: Planar process , p—n junction isolation , and Surface passivation. Main article: Transistor—transistor logic. Further information: MOS integrated circuit.
See also: List of semiconductor scale examples , Mixed-signal integrated circuit , Moore's law , Three-dimensional integrated circuit , Transistor count , and Very Large Scale Integration.
Main articles: Electronic design automation , Hardware description language , and Integrated circuit design. This article needs additional citations for verification.
Please help improve this article by adding citations to reliable sources. Unsourced material may be challenged and removed.
Main article: Semiconductor fabrication. Main article: Integrated circuit packaging. Main article: Integrated circuit layout design protection.
This article needs to be updated. Please update this section to reflect recent events or newly available information. October Further information: Heat generation in integrated circuits.
Main article: Very-large-scale integration. Further information: Wafer-scale integration , System on a chip , and Three-dimensional integrated circuit.
Electronics portal. Retrieved 14 March Nowadays when people say 'integrated circuit' they usually mean a monolithic IC, where the entire circuit is constructed in a single piece of silicon.
The Art of Electronics 2nd ed. Cambridge University Press. Integrated circuits, which have largely replaced circuits constructed from discrete transistors, are themselves merely arrays of transistors and other components built from a single chip of semiconductor material.
CHM Blog. Computer History Museum. Retrieved 13 August History of Semiconductor Engineering. Johns Hopkins University Press.
Proceedings of the IEEE. Those of us active in silicon material and device research during — considered this successful effort by the Bell Labs group led by Atalla to stabilize the silicon surface the most important and significant technology advance, which blazed the trail that led to silicon integrated circuit technology developments in the second phase and volume production in the third phase.
Solid State Technology. Patent 3,, granted on 10 April , filed 22 April Archived from the original on 19 September Retrieved 22 April MIT Press.
EE Times. Archived from the original on 7 January Retrieved 23 April Mackenzie 16 May American Microelectronics Data Annual — World Scientific.
Retrieved 25 May The Electrochemical Society Interface. Retrieved 3 August Retrieved 22 July IEEE Spectrum. Institute of Electrical and Electronics Engineers.
The Silicon Engine. Retrieved 13 October Scientific American. Bibcode : SciAm. Retrieved 1 August Dennard, and Ghavam G.
Shahidi Retrieved 11 February Fujita A decade of MEMS and its future. Narasimha; et al. Birkholz; A. Mai; C. Wenger; C. Meliani; R.
Scholz WIREs Nanomed. Graham; J. Robbins; C. Bowen; J. Taylor Semiconductor Engineering. Electronic Design Automation Consortium.
Archived from the original on 2 August Retrieved 29 July Gray; Paul J. Hurst; Stephen H. Lewis; Robert G. Meyer Analysis and Design of Analog Integrated Circuits.
Rabaey; Anantha Chandrakasan; Borivoje Nikolic Digital Integrated Circuits 2nd ed. Retrieved 22 October Washington, D.
Bloomburg Businessweek. Retrieved 20 May United States Copyright Office. L 24 IEEE Micro. Digital Apollo: Human and Machine in Spaceflight. The MIT Press.
Olympus Publishing Company. We were burning: Japanese entrepreneurs and the forging of the electronic age. Basic Books. Bibcode : ITED The Editors of Encyclopaedia Britannica Encyclopaedia Britannica's editors oversee subject areas in which they have extensive knowledge, whether from years of experience gained by working on that content or via study for an advanced degree See Article History.
Britannica Quiz. Computers and Technology Quiz. Which of these was the first programmable general-purpose electronic digital computer?
Learn More in these related Britannica articles:. In effect, this kind of integrated circuit can interpret and execute program instructions as well as handle arithmetic operations.
Integrated circuit IC , an assembly of electronic components, fabricated as a single unit, in which miniaturized active devices e.
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